Enhance Safety in Semiconductor Wafer Fabs with Mott’s Penta® Nickel Filters

By Paul Hofemann

In the high-stakes environment of semiconductor wafer fabrication (wafer fabs), ensuring the safety and efficiency of bulk oxygen gas systems is paramount. One crucial aspect of maintaining this safety involves the use of high-quality filter elements to prevent catastrophic failures. Mott Corporation’s Penta® Nickel Porous Metal Filters provide an effective solution to this challenge, offering superior protection against the dangers of adiabatic compression ignition.

Understanding the Semiconductor Wafer Fab

A semiconductor wafer fab, or wafer fabrication facility, is a specialized processing plant where silicon wafers are transformed into integrated circuits (ICs). These facilities are essential for producing the microchips that power a wide range of devices, from smartphones to medical equipment. The precision and cleanliness required in wafer fabs are unparalleled, as even the smallest contaminants can compromise the functionality of the entire batch of wafers.

The Dangers of Adiabatic Compression Ignition

What is Adiabatic Compression Ignition?

Adiabatic compression, often referred to as the “gas hammer” effect or metal fire, occurs in high-pressure oxygen systems when a valve is opened quickly. The rapid influx of oxygen into the high-pressure tubing can cause adiabatic compression at the end of the tubing near the next valve or regulator. This results in a temporary spike in pressure and temperature without any external heat input. The increased temperature can ignite materials that are otherwise non-flammable, leading to catastrophic failures.

Real-World Implications

High-pressure oxygen systems are particularly susceptible to adiabatic compression ignition when materials that cannot withstand high ignition energy, such as Teflon, are used. The results can be devastating, as seen in numerous incidents where improper material selection led to explosions and fires.

According to the Compressed Gas Association’s (CGA) guidelines on oxygen pipeline and piping systems, filter elements are critical points of concern due to their particle-retention function and high surface area to volume ratio. This makes the material selection for these elements crucial to preventing ignition.

Mott’s Solution: Penta® Nickel Porous Metal Filters

Why Nickel?

Nickel is a superior material for use in high-pressure oxygen systems due to its high ignition temperature compared to plastics, Teflon, or 316 stainless steel. Additionally, nickel’s high surface area acts as a heat sink, quenching any potential flame and preventing ignition.

Key Benefits of Penta® Nickel Filters

• Hydrophobic Properties: Nickel’s hydrophobic qualities result in significantly reduced dry-down times, achieving 10 parts per billion (ppb) of H2O in minutes rather than hours.
• Superior Filtration: Mott’s Penta® Nickel filters offer 1.5 nm filtration, compared to the industry standard of 3 nm, ensuring superior contaminant removal.
• Cost Efficiency: While comparable in cost to Teflon at higher flow rates, nickel filters provide a higher integrity material that lasts longer, thus reducing the overall cost of ownership.
• Proven Reliability: Penta® Nickel media has been proven in wafer fabs for over 15 years, demonstrating its reliability and effectiveness in critical applications.

Avoiding Common Pitfalls

Using nickel screens in front of Teflon filters is an inadequate solution and can be potentially dangerous. The screen does not help to reduce the high temperatures caused by adiabatic pressure buildup and can still lead to ignition. Mott’s Penta® Nickel filters provide a comprehensive solution that addresses both filtration and temperature control needs.

The Mott Advantage: GASSHIELD® Point-of-Use Penta® Nickel Bulk Filters

Mott’s GasShield® Point-of-Use Penta® Nickel Bulk Filters are designed to enhance the safety and performance of bulk oxygen gas systems in semiconductor wafer fabs. These filters offer:

• Rapid Dry-Down: Achieving 10 ppb of H2O in minutes, not hours.
• High-Efficiency Filtration: 1.5 nm filtration for superior contaminant removal.
• Proven Performance: Over 15 years of reliability in wafer fabs.
• Versatile Flow Rates: Available in flow rates from 1500 SLPM to 60,000 SLPM.
• Cost-Effective: Comparable in cost to Teflon at higher flow rates, providing a more durable and long-lasting solution.

Ensuring Safety and Efficiency in Wafer Fabs

In the demanding environment of semiconductor wafer fabs, the choice of filtration materials and technology can significantly impact safety and operational efficiency. Mott’s Penta® Nickel Porous Metal Filters offer a robust, reliable, and cost-effective solution to the challenges posed by high-pressure oxygen systems.

Contact Us Today

For more information about how Mott’s high purity filters can enhance the safety and efficiency of your semiconductor wafer fab, contact our High Purity Sales Team today. By leveraging Mott’s expertise and advanced filtration solutions, you can ensure the safety and efficiency of your wafer fab, keeping pace with the fast-evolving semiconductor industry.